Molding

Die attach

Datacon 2200 evo plus multichip die bonder

  • Highest accuracy ± 7 µm @ 3 Sigma
  • Uptime>98 %, yield > 99.95 %
  • Die attach, flip chip, multichip in one single machine
  • Die can be picked from wafers, waffle/gelpack, feeder and placed on boat, substrate, PCB, wafer, etc
Datacon 2200 evo plus
Read more

Datacon 2200 evo multichip die bonder

  • High accuracy ± 10 µm @ 3 Sigma
  • Die attach, flip chip, multichip in one single machine
  • Die can be picked from wafers, waffle/gelpack, feeder
  • Die can be placed on boat, substrate, PCB, wafer, etc
Datacon 2200 evo
Read more

Datacon Tape Reel Sorter CS 1250

  • Picks, flips and places from wafer to tape reel
  • Handles units from 0.3 mm up to 10 mm
  • Wafers up to 300 mm diameter
  • Placement accuracy ± 37μm @ 3 sigma
Datacon CS 1250
Read more

Datacon 8800 Smart Line

  • RFID high speed placement line
  • Adhesive dispensing system with ± 25 µm accuracy
  • Capability down to 0.3 mm die size with accuracy of 15 µm @ 3s
  • Handles 6”, 8” and 12” wafers as standard
Read more

Molding

Fico AMS-W Map Molding system

  • Molding system for QFN, BGA, BOC and BGA-MAP
  • Including Flip Chip, Multi Chip array and Stacked Die
  • Cleanroom class 1000
Fico AMS-W
Read more

Contact us

Find us >>